The Ball Bonder Machine Market is expected to grow at 4.04% CAGR in 2020-2031 with a market size of 1398.70 Million
The ball bonding method is ideal for fine pitch applications with pitches of less than 40 microns. The spark from the electronic flame off beneath the capillary still forms a free air ball using a ball bonding method before the bonding begins. When the capillary comes into contact with the bond pads surface and provides force and ultrasonic for the specified length of time, the free airball becomes twisted. Intermetallic bonding occurs by inter-diffusion between the wire & the bond pad metallization.
COVID-19 Impact Assessment
The Pandemic cases were on the rise throughout the world, causing a global economic downturn. COVID-19 had an influence on every area of the economy, including the semiconductor industry worldwide. COVID-19, on the other hand, had little effect on equipment demand. Palomar Technologies, for example, declared in April 2020 that essential semiconductor components are in high demand. Orders for 3880 ball bonder machines for remote machine equipment, medical devices, & robotics have increased. Demand for equipment has not decreased as a result of COVID-19. As a result, the worldwide ball bonder machine market is likely to grow in the next year.
Key Trends & Drivers
During the forecast period, the ball bonder machine market is likely to benefit from the development of new electronic goods such as smartphones with enhanced functionality and new standards. The transition of end-users from manual to automated ball bonder machines is likely to push the ball bonder machine market in the coming years.
The introduction of new packaging technologies such as TSV packaging and MEMs packaging has changed the semiconductor industrys entire production landscape. As a result, equipment manufacturers must make considerable investments to ensure producing products that are cutting-edge in technology. The market growth rate is forecast to be hampered to some extent throughout the forecast period due to the increasing complexity of consumption and manufacturing processes, the additional time required, and the rising possibility of errors. Despite these obstacles, the growing usage of 3D chip packing has boosted the growth of the ball bonder machine industry.
Key Players
Kulicke & Soffa, ASM Pacific Technology, KAIJO, SHINKAWA, F&K, Hesse, ULTRASONIC ENGINEERING, MICRO POINT PRO, Planar, West-Bond, Questar Products, TPT, PALOMAR, Mech-El Industries, and Anza Technology are among the main companies in this industry.
Regional Assessment
Because of the substantial investment made by vendors in the technical advancement of the chip manufacturing process, the Asia Pacific ball bonder machine market is likely to expand very fast. During the forecast period, the Asia Pacific consumer electronics market is likely to grow at a rapid pace.
As a result, the semiconductor industry will develop, and demand for semiconductor production and packaging equipment, such as ball bonder equipment, will increase. The increase in design complexity such as smaller versions, usage of metallic cases, & larger screens in smartphones and other devices has reduced the space available for semiconductor components, boosting the market for ball bonder machines in APAC.
Report Highlights
• Historical data available (as per request)
• Estimation/projection/forecast for revenue and unit sales (2021-2031)
• Data breakdown for every market segment (2021-2031)
• Gross breakdown for every market segment (2021-2031)
• Price analysis of each product type
• Business trend and expansion analysis
• Import and export analysis
• Competition analysis/market share
• Supply chain analysis
• Client list and case studies
• Market entry strategy
Industry and Revenue Segmentation
Type Analysis (Revenue, USD Million, 2021-2031)
• Manual Ball Bonder
• Semi-Automatic Ball Bonder
• Fully Automatic Ball Bonder
Application Analysis (Revenue, USD Million, 2020-2031)
• IDM
• OSAT
Key Company Analysis (Revenue, USD Million, 2020-2031)
• Kulicke & Soffa
• ASM Pacific Technology
• KAIJO
• SHINKAWA
• F&K
• Hesse
• ULTRASONIC ENGINEERING
• MICRO POINT PRO
• Planar
• West-Bond
• Questar Products
• TPT
• PALOMAR
• Mech-EI Industries
• Anza Technology
• Others
Regional Analysis (Revenue, USD Million, 2020 – 2031)
• United States
• Canada
• Mexico
• France
• Germany
• Italy
• Spain
• United kingdom
• China
• India
• Philippines
• Malaysia
• Australia
• Austria
• South Korea
• UAE
• Qatar
• Saudi Arabia
• Japan
• Africa
• Rest of the world
Available Versions:
• United States Ball Bonder Machine Industry Research Report
• Europe Ball Bonder Machine Industry Research Report
• Asia Ball Bonder Machine Industry Research Report
