CMP Cleaning Solutions Market shall reach a value of $2x61.4 Million in 2027, growing with a CAGR of 12.13% during the forecast period of 2020 to 2027.
Market Definition / Research Scope
For the purpose of this market research report, CMP (Chemical Mechanical Planarization) Cleaning is defined as the solution used to remove abrasive materials like silica and alumina from Si, silicon oxide, low-k dielectrics, nitride, tungsten, and copper surfaces for CMP integration. It is used for planarization of various thin films in the front- and back-end processing. The use of Chemical Mechanical Planarization Cleaning solutions provides corrosion control, and removes surface contamination. It allows a reduced operation performance cost.The use of CMP cleaning solutions is preferred as it is able to remove contamination without generating any defects. Newer CMP Cleaning solutions are being developed to meet the stricter needs of Cu-Cu direct bonding surfaces.
Intensive application of the CMP Cleaning solutions in the removal of organic contaminants is estimated to drive the growth factor in the global market. The Asia Pacific region is expected to account for the highest shares in the market and dominate other regions owing to rising demands of CMP cleaning solutions that are incensed to remove contaminants with reduced galvanic corrosion. The efficacy and potency of the CMP cleaning solutions are expected to give rise to prevalent demands in the North American region for a solution that possesses an equilibrium potential to remove BTA related organic residues from surfaces. Europe too is expected to streamline its growth segment with other regions in the market owing to the increasing demand by the commercial and residential sectors for a cleaning solution that removes silica abrasives and other contaminants from surfaces.