System in Package (SiP) Technology Market is segmented By Interconnection Technology (Wire Bond and Flip Chip), By Packaging Technology (2-D IC Packaging, 2.5-D IC Packaging, 3-D IC Packaging), and By Application (Consumer Electronics, Aerospace and Defense, Automotive, Telecommunication, Industrial System, and Others) and Region (United States, Canada, Mexico, South America, France, Germany, Italy, Spain, United Kingdom, Russia, China, India, Philippines, Malaysia, Australia, Austria, South Korea, Middle East, Japan, South Africa, Rest of World)
System in Package (SiP) Technology Market size was estimated at $20,400 million in 2020 and is expected to reach $41,850 million by 2028, growing at a CAGR of 8.1% during the forecast period of 2021 to 2028.
System-in-package (SiP) die technologies are a packaging technique for integrating numerous electronic sub-components on a single substrate with other passive components. One significant advantage of system-in-package (SiP) die technologies is theyre not just an integrated circuit package containing many dies but also feature actively working systems or subsystems. As a result, siP technologies enable the simultaneous operation of several active electronic components in a single unit. With the aid of technology, the production of more affordable electronic items is accelerating.
Miniaturization has gained popularity in the electrical sector in recent years. This is expected to increase demand for system-in-package (SiP) die technologies globally throughout the projected period. SiP die technologies are commonly used in CPUs and graphics cards to increase gaming and video output. Players in the worldwide system-in-package (SiP) die technologies market invest heavily in the research and development of such packaging materials to maintain a competitive edge.
System in Package (SiP) Technology Market Growth and Trend
Rapid research and development, combined with technical advancements, have generated a market for dependable and small electronic gadgets. This has increased the demand for small electrical devices. Numerous electronic goods have grown in sophistication due to the advancement of semiconductor technology, which necessitated integrated circuit packaging technology for logic, memory, radiofrequency, and sensor integration into compact form factors. The SiP enables high-performance, low-power solutions in compact packages. Additionally, the shorter wire length in SiP aids in improving circuit performance and it lowers power consumption by regulating cycle duration and energy dissipation. Furthermore, the SiP technique enables the seamless integration of many multichip modules, such as DRAM and others. Thus, the growing usage of integrated circuit packaging technology in small form factors for the creation of downsized electronic devices is propelling the growth of this market.
The growing demand for compact sensors with integrated packaging technologies, which include image sensors, environment sensors, and controllers, is driving manufacturers to develop a variety of integrated circuits (ICs) that meet stringent safety requirements, have a short time to market, and are cost-effective for the various functions required by intelligent automotive. For example, ON Semiconductor launched a range of car sensors in 2019, including a next-generation RGB-IR image sensor for in-cabin purposes and the Hayabusa family of CMOS image sensors for advanced driving assistance systems (ADAS) and watching car camera systems.
Wireless networks would experience severe congestion over the next five years without the availability of high-bandwidth devices. This would accelerate the transition from current 3G and 4G LTE technologies to 5G. The aggregate data rates supported by 5G technology are predicted to be much faster than those enabled by present 3G and 4G technologies.
Several major nations, including the United States, Japan, South Korea, the United Kingdom, Germany, and China, are anticipated to install 5G technology by 2021. This is likely to considerably expand the number of mobile customers, necessitating the development of infrastructure capable of handling user data demand. As a result, the need for SiP-based RF components will rise to meet the higher data rate and enhanced signal quality required for actual deployment.
But again, using high-bandwidth RF components in wireless devices, including a front-end module (FEM), a power amplifier module (PAM), an antenna switch module (ASM), an RFID module, and a local interconnect network (LIN) transceiver SiP module, would present design issues, such as simulating multiple chips, passive circuits, and interconnects in a complete unit. On the other hand, this creates an opportunity for SiP-based RF components to participate in the construction of a sophisticated 5G infrastructure.
System in Package (SiP) Technology Market Segmentation
The System in Package (SiP) technology market is segmented by interconnection technology, packaging technology, and application. Based on interconnection technology, the market consists of wire bond and flip chip. Based on packaging technology, the market is segmented into 2-D IC packaging, 2.5-D IC packaging, 3-D IC packaging. Based on application, the market is divided into consumer electronics, aerospace, and defense, automotive, telecommunication, industrial system, and others.
System in Package (SiP) Technology Market Country Analysis
North America is likely to see an increase in demand for systems in packaging technology due to increased acceptance of connected devices, quick investment in 5G growth, and widespread deployment of robots to automate different workflows for increased efficiency. However, the Asia Pacific dominated the worldwide system in package (SiP) technology market in 2018 and is expected to continue to do so in the years ahead. This geographical expansion may be attributable to growing nations like China and India, which account for a sizable portion of this regional market. In addition, increased technology adoption across the area, increased demand for semiconductors and devices, rising disposable income, and massive expenditures in consumer electronics will all contribute to the areas markets future growth.
System in Package (SiP) Technology Market Share and Competition
The major players operating in the global System in Package (SiP) technology market are Toshiba, Fujitsu, Renesas Electronics, Samsung, Amkor, ASE Group, Chipmos Technologies, Jiangsu Changjiang Electronics, and Powertech Technology.
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• Estimation/projections/forecast for revenue and unit sales (2021 – 2028)
• Data breakdown for every market segment (2021 – 2028)
• Gross margin and profitability analysis of companies
• Price analysis of each product type
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Industry Segmentation and Revenue Breakdown
Interconnection Technology Analysis (Revenue, USD Million, 2021 - 2028)
• Wire Bond
• Flip Chip
Packaging Technology Analysis (Revenue, USD Million, 2021 - 2028)
• 2-D IC Packaging
• 2.5-D IC Packaging
• 3-D IC Packaging
Application Analysis (Revenue, USD Million, 2021 - 2028)
• Consumer Electronics
• Aerospace and Defense
• Industrial System
Region Analysis (Revenue, USD Million, 2021 – 2028)
• North America
o United States
• South America
o United Kingdom
• Asia Pacific
o South Korea
• Middle East
o GCC C ountries
o South Korea
• South Africa
• Rest of World
System in Package (SiP) Technology Market Companies
• Renesas Electronics
• ASE Group
• Chipmos Technologies
• Jiangsu Changjiang Electronics
• Powertech Technology
• United States System in Package (SiP) Technology Industry Research Report
• Europe System in Package (SiP) Technology Industry Research Report
• Asia Pacific System in Package (SiP) Technology Industry Research Report
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