Advanced Packaging Market is segmented By Component (3D Integrated Circuit, 2D Integrated Circuit, 2.5D Integrated Circuit, Wafer Level Chip Scale Package, Flip Chip, Fan Out Silicon in Package, Fan Out Wafer Lever Package, and Others), By Industry Vertical (Consumer Electronics, Automotive & Transport, IT & Telecommunication, Industrial, Healthcare, Aerospace & Defense, and Others) and Region (United States, Canada, Mexico, South America, France, Germany, Italy, Spain, United Kingdom, Russia, China, India, Philippines, Malaysia, Australia, Austria, South Korea, Middle East, Japan, South Africa, Rest of World)
Advanced Packaging Market size was estimated at $3715.78 million in 2020 and is expected to reach $7677.29 million by 2028, growing at a CAGR of 11% during the forecast period of 2021 to 2028.
Advanced packaging technology has evolved to reduce the cost of manufacturing while increasing the total throughput and performance of integrated circuits. Additionally, since semiconductor integrated circuits have become more prevalent in vehicles, the demand for sophisticated packaging has grown significantly in recent years.
Advanced packaging is a protective shell that protects silicon wafers, logic units, and memory from physical damage and corrosion during the final step of the semiconductor manufacturing process. The chips advanced packaging enables it to be attached to a circuit board. Additionally, it encompasses the grouping of several unique methods, such as 2.5D, 3D-IC, fan-out wafer-level packaging, and system-in-package.
It established a new paradigm for chip design and revolutionized semiconductor production techniques. Foundries have benefited significantly from the automation of sophisticated packaging processes, a trend that has been accelerated by expanding advances in electronic design automation. Efforts are being made to develop improved packaging that is capable of meeting a variety of power dissipation, field functioning, and, most crucially, cost requirements. The advanced packaging industry has evolved in response to the increasing need for high-performance semiconductors in a variety of consumer devices.
Advanced Packaging Market Growth and Trend
With rapid expansion in the advanced packaging market, particularly fan-out wafer-level packaging, and increased demand for smartphones, devices, and the Internet of Things (IoT), advanced packaging providers are trying to develop processes and methods to improve the efficiency of advanced packaging while maintaining maximum operational efficiency. Due to the high cost of operation, sophisticated packaging has been mostly utilized for high-end products and applications in specialized markets such as wafer and die manufacturing in recent years. Different integrated circuits (ICs) have varying packaging needs, creating the potential for advanced packaging to outperform standard packaging processes. Additionally, advanced packaging is projected to have greater capabilities than traditional packaging, creating profitable prospects for advanced packaging market trends in the approaching years.
Advanced packaging has ushered in a new era of chip design and revolutionized semiconductor production methods. Foundries have benefited significantly from the automation of sophisticated packaging processes, a trend that has been accelerated by expanding advances in electronic design automation. Efforts are being made to develop improved packaging that is capable of meeting a variety of power dissipation, field functioning, and, most crucially, cost requirements. The advanced packaging industry has evolved in response to the increasing need for high-performance semiconductors in a variety of consumer devices.
With the progress of technology, manufacturers are placing a premium on small electronic devices across a variety of industry verticals, including consumer electronics, medical, automotive, and microprocessor integrated circuit production. These firms are shrinking integrated circuits to achieve precise patterning on wafers and chips. Additionally, the medical device sector is seeing an increase in demand for nanoscale robotic surgery technology that has evolved into wearable and customized healthcare gadgets. As a result of the drive toward smaller electronic gadgets, designers have been forced to go beyond conventional packaging methods and use advanced packaging.
The semiconductor packaging business is supplying improved integrated circuit packages to enable the development of next-generation chip designs. Historically, the integrated circuit industry relied on conventional chip scaling and novel designs to create new devices. Additionally, every phone, data center, electronic products, and the network has multi-chip packages, which contribute to the rise of advanced packaging by facilitating system optimization. Advanced packaging facilitates the use of AI, data science, and deep learning by enabling the coupling of several different processing units and memory via extremely high-speed interconnects. Thus, increased operating capabilities and accurate processing are advantageous for a variety of industry verticals, including automotive, healthcare, aerospace & military, and the industrial sector, all of which have begun to embrace advanced packaging.
Advanced Packaging Market Segmentation
The advanced packaging market is segmented by component and industry vertical. Based on component, the market consists of 3D integrated circuit, 2D integrated circuit, 2.5D integrated circuit, wafer level chip scale package, flip chip, fan out silicon in package, fan out wafer lever package, and others. Based on industry vertical, the market is divided into consumer electronics, automotive & transport, IT & Telecommunication, industrial, healthcare, aerospace & defense, and others.
Advanced Packaging Market Country Analysis
Asia-Pacific is anticipated to expand at a rapid pace. Throughout the projection period, it has been a significant income generator, owing largely to the rising population and consumer demands. Major industrial automation businesses that have been operating in the region for an extended period are fueling the demand for sophisticated semiconductor packaging. By focusing on end-to-end yield improvements, semiconductor firms in the Asia-Pacific area are effectively managing cost challenges and sustaining better profitability. The road forward entails a cultural transformation and the use of innovative packaging techniques.
Advanced Packaging Market Share and Competition
The major players operating in the global advanced packaging market are International Business Machines Corporation (IBM), Amkor Technology, ASE Group, Precision Industries Co., Ltd., Qualcomm Technologies, Inc., STATS ChipPAC Pte. Ltd., Siliconware, SSS MicroTec AG., Intel Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd., and Taiwan Semiconductor Manufacturing Company.
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• Estimation/projections/forecast for revenue and unit sales (2021 – 2028)
• Data breakdown for every market segment (2021 – 2028)
• Gross margin and profitability analysis of companies
• Price analysis of each product type
• Business trend and expansion analysis
• Import and export analysis
• Competition analysis/market share
• Supply chain analysis
• Client list and case studies
• Market entry strategy
Industry Segmentation and Revenue Breakdown
Component Type Analysis (Revenue, USD Million, 2021 - 2028)
• 3D Integrated Circuit
• 2D Integrated Circuit
• 2.5D Integrated Circuit
• Wafer Level Chip Scale Package
• Flip Chip
• Fan Out Silicon in Package
• Fan Out Wafer Lever Package
Industry Vertical Analysis (Revenue, USD Million, 2021 - 2028)
• Consumer Electronics
• Automotive & Transport
• IT & Telecommunication
• Aerospace & Defense
Region Analysis (Revenue, USD Million, 2021 – 2028)
• North America
o United States
• South America
o United Kingdom
• Asia Pacific
o South Korea
• Middle East
o GCC C ountries
o South Korea
• South Africa
• Rest of World
Advanced Packaging Market Companies
• International Business Machines Corporation (IBM)
• Amkor Technology
• ASE Group
• Precision Industries Co., Ltd.
• Qualcomm Technologies, Inc.
• STATS ChipPAC Pte. Ltd.
• SSS MicroTec AG.
• Intel Corporation
• Jiangsu Changjiang Electronics Technology Co. Ltd.
• Taiwan Semiconductor Manufacturing Company.
• United States Advanced Packaging Industry Research Report
• Europe Advanced Packaging Industry Research Report
• Asia Pacific Advanced Packaging Industry Research Report
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