Lead Frames Market shall reach a value of $2x61.4 Million in 2027, growing with a CAGR of 12.13% during the forecast period of 2020 to 2027.
Market Definition / Research Scope
A lead frame is a common type of chip package that uses metal leads that consists of metal structures inside a chip that carry signals from the die to the outside. This technology can trackback to the early days of DIP chips, but it is still widely used in many package types. In microelectronics, a double inline bundle (DIP) or double inline pin bundle (DIPP) is an electronic segment bundle with a rectangular housing and two equal columns of electrical interfacing pins. The package might be through opening mounted to a printed circuit board (PCB) or inserted in a socket.
Lead Frame Market Growth and Trends
The Asia Pacific region is estimated to dominate the lead frame market owing to the huge demand for electronic equipment manufacturing process in the industrially expanding nations such as China, Japan, India and Korea. This region is anticipated to see a surge in consumer electronics demand due to the large scale shift of manufacturing units, increased disposal incomes and growth in the spending capabilities. China leads the market value due to it leading both the manufacturing and consumption of electric vehicles. The rising use of ICE with electric vehicles has driven the lead frame market here. North America is a close second given the presence of a large consumer base and the presence of leading market players. Here, the surging sales of smartphones and the constant need for automation and innovation have driven the market value.
The presence of low quality counterfeit substitute products is expected to affect the market gravely.
Lead Frame Market Regional Analysis
The rise in demand from automotive industries and induction of electronics is expected to drive exponential growth in the market globally. The Asia Pacific region accounts for garnering the highest growth rate in the market with the rising demand for dual lead frame among the vendors. North American market is estimated to trail forward in the market with a rise in population in the country and expanding size of consumer electronics. Europe is projected to witness high growth in the market with internet penetration and the introduction of 5G in the region. The Middle Eastern region is expected to pace ahead on the market track with its rising commerce and increase in disposable income with changing lifestyle.The key driver for the lead frame market is the surging demand of consumer electronics. Lead frames are a crucial part of an electronic device. It is widely used in integrated circuits and semiconductor packing. Such packaging are highly cost effective making the entire process very economically beneficial thereby, promoting the lead frame market as the IC market experiences an all-time high. The constant rise of people relying on digitization has led to an increased electronic parts industry.
The wide spread use of electronics across several sectors such as automobile, healthcare, and the need for automation in daily life activity has further pushed the market for lead frame. The upsurging automobile industry has aided the lead frame market the maximum asserting to the extensive use of lead frames in the infotainment system and engine control unit. The constant need for customized products requires specialized lead frame product design pushing the market further. The rising market penetration of consumer electronics such as tablets and smartphones has increased the demand for lead frames. Miniaturization has further elevated the growth of the market globally.
Lead Frame Market Share and Competition
Key companies operating in this industry are: Mitsui High-tec, ASM Pacific Technology, Shinko, Samsung, Chang Wah Technology, SDI, POSSEHL, Kangqiang, Enomoto, JIH LIN TECHNOLOGY, DNP, Fusheng Electronics, LG Innotek and Hualong.
Lead Frame Market Research Report Analysis Highlights
• Historical data available (as per request)
• Estimation/projections/forecast for revenue and unit sales (2020 – 2027)
• Data breakdown for every market segment (2020 – 2027)
• Gross margin and profitability analysis of companies
• Price analysis of each product type
• Business trend and expansion analysis
• Import and export analysis
• Competition analysis/market share
• Supply chain analysis
• Client list and case studies
• Market entry strategy
Industry Segmentation and Revenue Breakdown
Type Analysis (Revenue, USD Million, 2020 - 2027)
• Stamping Process Lead Frame
• Etching Process Lead Frame
• Others
Application Analysis (Revenue, USD Million, 2020 - 2027)
• Integrated Circuit
• Discrete Device
• Other
Region Analysis (Revenue, USD Million, 2020 - 2027)
• United States
• Canada
• Mexico
• France
• Germany
• Italy
• Spain
• United Kingdom
• Russia
• China
• India
• Philippines
• Malaysia
• Australia
• Austria
• South Korea
• Middle East
• Japan
• Africa
• Rest of World
Lead Frame Market Companies
• Mitsui High-tec
• ASM Pacific Technology
• Shinko
• Samsung
• Chang Wah Technology
• SDI
• POSSEHL
• Kangqiang
• Enomoto
• JIH LIN TECHNOLOGY
• DNP
• Fusheng Electronics
• LG Innotek
• Hualong
Available Versions:-
United States Lead Frame Market Research Report
Europe Lead Frame Market Research Report
Asia Pacific Lead Frame Market Research Report
India Lead Frame Market Research Report
