Wafer Bonding System Market Report 2019 - 2026, Growth Trend, Revenue, Sales Volume Estimation and Forecast

By Type (anodic bonding, direct bonding, adhesive bonding, diffusion bonding, and glass-frit bonding), By Application (solar energy, semiconductor, MEMS and optoelectronics), By Region(North America, Europe, APAC and Rest of the World)

LATEST: This report includes COVID 19 Impact Analysis of the Market

  • Report ID : MD1229
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  • Pages : 185
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  • Tables : 95
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  • Formats :

Wafer Bonding System Market revenue is estimated to be $XX Billion in 2018 and shall grow with a CAGR of XX.X% during the forecast period of 2019 to 2026.
 
The market is anticipated to witness a tremendous growth in its market revenue owing to the rising demand and production of integrated chips, Silicon wafers, and other such products. Further, the rising application of this system in various fields such as solar energy, MEMS, semiconductor and optoelectronics are expected to fuel up the wafer bonding market sales over the forecast period. This system generates a chemical bond between two surfaces. The increasing acceptance of the direct bonding wafer system is going to enhance the wafer bonding market growth in the coming few years. Indirect bonding some other intermediary layer is not required for making chemical bonds between two surfaces. The high efficiency of the indirect bonding system is responsible for the high adoption of this system in industries across the world. The ongoing technological advancements and innovations in the wafer bonding technology are anticipated to propel the wafer bonding system market revenue significantly over the forecast period.
 
Moreover, the increasing usage of consumer electronics such as computers, smartphones, tablets, and laptops is anticipated to drive the wafer bonding market shares. In addition to this, Silicon manufacturing industries are using wafer bonding system at a significant level. Moreover, the actuators and sensors manufacturing industries are also using wafer bonding system significantly and thereby augmenting the wafer bonding business revenue during the forecast period. The most attractive feature driving the growth of this segment is the set of advantages offered by the wafer bonding system. Various advanced features provided by this system include compatibility to semiconductor technology, high bonding strength, and ability to bond in vacuum or different atmospheric gases as well.  Further, the wafer bonding system is stable at high temperatures. However, this process has limited strength and bonds are likely to hamper the market growth.

Europe and the Asia Pacific to dominate the wafer bonding market in terms of revenue:

The Europe and Asia Pacific regions are the dominant regions in contributing to the industry growth in 2018. The rising investment by the industry players of these regions is driving the shares of the market in these regions. Further, the U.S region is anticipated to fuel up the market shares significantly over the forecast period. Moreover, the Asia Pacific region is also anticipated to grow significantly over the forecast period owing to the rising investment by the industry players of the region.

Direct bonding segment is likely to dominate the market in terms of revenue:

Based on type, the segmentation has been done as anodic bonding, direct bonding, adhesive bonding, diffusion bonding, and glass-frit bonding.  Out of which, the direct bonding segment has dominated the market shares in 2018 and is anticipated to continue the same trend over the forecast period. Based on application, the market has been segmented as solar energy, semiconductor, MEMS and optoelectronics.

Wafer Bonding System Industry Players:

Major industry players have been analyzed with coverage on their operating areas, revenues, and other strategic aspects. Industry players are adopting various smart strategies to increase the wafer bonding market revenue. These industry players include Tokyo Electron, EV Group, Ayumi Industry, Palomar Technologies, SüSS Microtec SE,  NxQ, Applied Microengineering, 3M Corporation, and Dynatex International.

Key Points covered in the Report:
        
•    Revenue Estimation and Forecast (2018 – 2026)
•    Production Estimation and Forecast (2018 – 2026)
•    Breakdown of Revenue by Segments (2018 – 2026)
•    Breakdown of Production by Segments (2018 – 2026)
•    Gross Margin and Profitability Analysis of Companies
•    Business Trend and Expansion Analysis
•    Import and Export Analysis
•    Regional Analysis and Data Breakdown

MARKET SEGMENTATION

By Type Outlook ($Revenue, 2018-2026)

•    Anodic bonding
•    Direct Bonding
•    Adhesive bonding
•    Diffusion bonding
•    Glass-frit bonding

By Region Outlook ($Revenue, 2018-2026)

•    Solar energy
•    MEMS
•    Semiconductor
•    Optoelectronics

By Regional Outlook ($Revenue, 2018-2026)

•    North America
•    Canada
•    U.S
•    Mexico
•    Europe
•    Germany
•    France
•    U.K
•    Rest of Europe 

•    Asia-Pacific
•    China
•    India
•    Japan
•    Rest of Asia Pacific
•    Rest of the World
•    Middle East 
•    Africa
•    Latin America

Wafer Bonding System Industry Players:

•    Tokyo Electron
•    EV Group
•    Ayumi Industry
•    Palomar Technologies
•    SüSS Microtec SE
•    NxQ
•    Applied Microengineering
•    3M Corporation 
•    Dynatex International

CHAPTER 1:    INTRODUCTION

1.1. Research Methodology

1.1.1. Desk Research

1.1.2. Data Synthesis

1.1.3. Data Validation & Market Feedback

1.1.4. Data Sources

CHAPTER 2:    EXECUTIVE SUMMARY

2.1. Global Market Outlook

2.2. Core Insights - Type

2.3. Core Insights – Region

2.4. Core Insights – Geography

CHAPTER 3:    MARKET OVERVIEW

3.1.  Market Definition and Scope

3.2. Key Forces Shaping the Industry

3.2.1. Bargaining Power of Suppliers

3.2.2. Bargaining Power of Buyers

3.2.3. Threat of Substitutes

3.2.4. Threat of New Entrants

3.3. Market Dynamics

3.3.1. Drivers

3.3.1.1. Supply-side Drivers

3.3.1.2. Demand-side Drivers

3.3.2. Restraints

3.3.3. Opportunities

3.4. Industry Landscape - PESTEL Analysis

3.4.1. Political Landscape

3.4.2. Environmental Landscape

3.4.3. Social Landscape

3.4.4. Technology Landscape

3.4.5. Economic Landscape

CHAPTER 4:    MARKET BACKGROUND

4.1. Industry Value Chain Analysis

4.1.1. Upstream Participants

4.1.2. Downstream participants

4.2. Pricing Analysis and Forecast, 2018-2026

4.2.1. By Type

4.2.2. By Region

CHAPTER 5:  GLOBAL WAFER BONDING SYSTEM MARKET, BY TYPE

5.1. Overview

5.1.1. Market Volume and Forecast, 2018-2026

5.1.2. Market Revenue (US$ Million) and Forecast, 2018-2026

5.2. Anodic bonding

5.2.1. Key Market Trends, Growth Factors and Opportunities

5.2.2. Market Volume and Forecast, By Region

5.2.3. Market Revenue (US$ Million) and Forecast, By Region

5.3. Direct Bonding

5.3.1. Key Market Trends, Growth Factors and Opportunities

5.3.2. Market Volume and Forecast, By Region

5.3.3. Market Revenue (US$ Million) and Forecast, By Region

5.4. Adhesive bonding

5.4.1. Key Market Trends, Growth Factors and Opportunities

5.4.2. Market Volume and Forecast, By Region

5.4.3. Market Revenue (US$ Million) and Forecast, By Region

5.5. Diffusion bonding

5.5.1. Key Market Trends, Growth Factors and Opportunities

5.5.2. Market Volume and Forecast, By Region

5.5.3. Market Revenue (US$ Million) and Forecast, By Region

5.6. Glass-frit bonding

5.6.1. Key Market Trends, Growth Factors and Opportunities

5.6.2. Market Volume and Forecast, By Region

5.6.3. Market Revenue (US$ Million) and Forecast, By Region

CHAPTER 6:  GLOBAL WAFER BONDING SYSTEM MARKET, BY REGION

6.1. Overview

6.1.1. Market Volume and Forecast, 2018-2026

6.1.2. Market Revenue (US$ Million) and Forecast, 2018-2026

6.2. Solar energy

6.2.1. Key Market Trends, Growth Factors and Opportunities

6.2.2. Market Volume and Forecast, By Region

6.2.3. Market Revenue (US$ Million) and Forecast, By Region

6.3. MEMS

6.3.1. Key Market Trends, Growth Factors and Opportunities

6.3.2. Market Volume and Forecast, By Region

6.3.3. Market Revenue (US$ Million) and Forecast, By Region

6.4. Semiconductor

6.4.1. Key Market Trends, Growth Factors and Opportunities

6.4.2. Market Volume and Forecast, By Region

6.4.3. Market Revenue (US$ Million) and Forecast, By Region

6.5. Optoelectronics

6.5.1. Key Market Trends, Growth Factors and Opportunities

6.5.2. Market Volume and Forecast, By Region

6.5.3. Market Revenue (US$ Million) and Forecast, By Region

CHAPTER 7:  GLOBAL WAFER BONDING SYSTEM MARKET, BY GEOGRAPHY

7.1. Overview

7.2. North America

7.2.1. Key Market Trends, Growth Factors and Opportunities

7.2.2. Market Volume and Forecast, By Type

7.2.3. Market Volume and Forecast, By Region

7.2.4. Market Revenue and Forecast, By Type

7.2.5. Market Revenue and Forecast, By Region

7.2.6. Market Revenue and Forecast, By Country

7.2.7. U.S.

7.2.7.1. Market Volume and Forecast

7.2.7.2. Market Revenue and Forecast

7.2.8. Canada

7.2.8.1. Market Volume and Forecast

7.2.8.2. Market Revenue and Forecast

7.2.9. Mexico

7.2.9.1. Market Volume and Forecast

7.2.9.2. Market Revenue and Forecast

7.3. Europe

7.3.1. Market Volume and Forecast, By Type

7.3.2. Market Volume and Forecast, By Region

7.3.3. Market Revenue and Forecast, By Type

7.3.4. Market Revenue and Forecast, By Region

7.3.5. Market Revenue and Forecast, By Country

7.3.6. Germany

7.3.6.1. Market Volume and Forecast, By Type

7.3.6.2. Market Revenue and Forecast, By Region

7.3.7. UK

7.3.7.1. Market Volume and Forecast, By Type

7.3.7.2. Market Revenue and Forecast, By Region

7.3.8. France

7.3.8.1. Market Volume and Forecast, By Type

7.3.8.2. Market Revenue and Forecast, By Region

7.3.9. Italy

7.3.9.1. Market Volume and Forecast, By Type

7.3.9.2. Market Revenue and Forecast, By Region

7.3.10. Rest of Europe

7.3.10.1. Market Volume and Forecast, By Type

7.3.10.2. Market Revenue and Forecast, By Region

7.4. Asia-Pacific

7.4.1. Market Volume and Forecast, By Type

7.4.2. Market Volume and Forecast, By Region

7.4.3. Market Revenue and Forecast, By Type

7.4.4. Market Revenue and Forecast, By Region

7.4.5. Market Revenue and Forecast, By Country

7.4.6. China

7.4.6.1. Market Volume and Forecast, By Type

7.4.6.2. Market Revenue and Forecast, By Region

7.4.7. India

7.4.7.1. Market Volume and Forecast, By Type

7.4.7.2. Market Revenue and Forecast, By Region

7.4.8. Japan

7.4.8.1. Market Volume and Forecast, By Type

7.4.8.2. Market Revenue and Forecast, By Region

7.4.9. South Korea

7.4.9.1. Market Volume and Forecast, By Type

7.4.9.2. Market Revenue and Forecast, By Region

7.4.10. Rest of Asia-Pacific

7.4.10.1. Market Volume and Forecast, By Type

7.4.10.2. Market Revenue and Forecast, By Region

7.5. REST OF THE WORLD

7.5.1. Market Volume and Forecast, By Type

7.5.2. Market Volume and Forecast, By Region

7.5.3. Market Revenue and Forecast, By Type

7.5.4. Market Revenue and Forecast, By Region

7.5.5. Market Revenue and Forecast, By Country

7.5.6. Latin America

7.5.6.1. Market Volume and Forecast, By Type

7.5.6.2. Market Revenue and Forecast, By Region

7.5.7. Middle East

7.5.7.1. Market Volume and Forecast, By Type

7.5.7.2. Market Revenue and Forecast, By Region

7.5.8. Africa

7.5.8.1. Market Volume and Forecast, By Type

7.5.8.2. Market Revenue and Forecast, By Region

CHAPTER 8:    COMPETITIVE LANDSCAPE

8.1. Wafer Bonding System Market Share Analysis, 2018

CHAPTER 9:    COMPANY PROFILES

9.1. Tokyo Electron

9.1.1. Company Overview

9.1.2. Financial Performance

9.1.3. SWOT Analysis

9.2. EV Group

9.2.1. Company Overview

9.2.2. Financial Performance

9.2.3. SWOT Analysis

9.3. Ayumi Industry

9.3.1. Company Overview

9.3.2. Financial Performance

9.3.3. SWOT Analysis

9.4. Palomar Technologies

9.4.1. Company Overview

9.4.2. Financial Performance

9.4.3. SWOT Analysis

9.5. SüSS Microtec SE

9.5.1. Company Overview

9.5.2. Financial Performance

9.5.3. SWOT Analysis

9.6. NxQ

9.6.1. Company Overview

9.6.2. Financial Performance

9.6.3. SWOT Analysis

9.7. applied Microengineering

9.7.1. Company Overview

9.7.2. Financial Performance

9.7.3. SWOT Analysis

9.8. 3M Corporation

9.8.1. Company Overview

9.8.2. Financial Performance

9.8.3. SWOT Analysis

9.9. Dynatex International

9.9.1. Company Overview

9.9.2. Financial Performance

9.9.3. SWOT Analysis

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